硬软结合板制造
制程能力
NO.
|
|
能力
|
标准生产
|
先进生产
|
|
---|---|---|---|---|---|
1
|
面板尺寸
|
双面
|
沉金/浸锡
|
250/500*900mm
|
250/500*1200mm
|
≥4层
|
沉金/浸锡
|
250/500*710mm
|
250/500*1200mm
|
||
2
|
叠起
|
盲板/埋板
|
压制次数
|
MAX≤3times
|
MAX≤3times
|
铜厚
|
内层
|
1/3OZ-2OZ(FCCL)
最大2OZ |
1/3OZ-2OZ(FCCL)
最大2OZ |
||
外层
|
1/3OZ-3OZmm
|
1/3OZ-3OZmm
|
|||
最小介电常数ThK
|
0.025mm(FCCL)
0.043mm(CCL) |
0.0125mm(FCCL)
0.043mm(CCL) |
|||
最大层数
|
18L
|
24L
|
|||
最终板 ThK 公差
|
ThK≤1.0mm
|
±0.1mm
|
±0.1mm
|
||
ThK>1.0mm
|
±10%
|
±10%
|
|||
3
|
线/空
|
内层
|
1/3OZ
|
2/2mil
|
1.5/1.5mil
|
1/2OZ
|
2.5/2.5mil
|
2/2mil
|
|||
1OZ
|
3.0/3.0mil
|
3.0/3.0mil
|
|||
2OZ
|
6/5.5mil
|
6/5.5mil
|
|||
外层
|
1/3OZ
|
3/3mil
|
3/3mil
|
||
1/2OZ
|
3.5/3.5mil
|
3.5/3.5mil
|
|||
1OZ
|
5/5mil
|
5/5mil
|
|||
2OZ
|
6/8mil
|
6/8mil
|
|||
3OZ
|
8/11mil
|
8/11mil
|
|||
焊盘公差
|
≤12mil
|
±1.2mil
|
±1.2mil
|
||
>12mil
|
±10%
|
±10%
|
|||
4
|
钻头
|
机械钻尺寸
|
0.15-6.35mm
|
0.1-6.35mm
|
|
PTH孔公差
|
±0.075mm
|
±0.075mm
|
|||
NPTH 孔公差
|
±0.05mm
|
±0.05mm
|
|||
电镀槽公差
|
长槽
|
±0.075mm
|
±0.075mm
|
||
短槽
|
±0.075mm
|
±0.075mm
|
|||
纵横比
|
DHS=0.15mm
|
7:1
|
7:1
|
||
DHS=0.2mm
|
10:1
|
10:1
|
|||
DHS ≥0.25mm
|
15:1
|
15:1
|
|||
背钻(背钻/控深钻)
|
Hole size
|
0.4-6.35mm
|
0.4-6.35mm
|
||
Back drill relative to through hole
|
≥0.2mm
|
≥0.2mm
|
|||
Back drill depth tolerance
|
±0.1mm
|
±0.1mm
|
|||
Stub length
|
0.05-0.25
|
0.05-0.25
|
|||
5
|
最小BGA
|
1.0mm BGA 2 走线
|
Yes
|
Yes
|
|
0.8mm BGA 1 走线
|
Yes
|
Yes
|
|||
0.65mm BGA
|
Yes
|
Yes
|
|||
0.5mm BGA
|
Yes
|
Yes
|
|||
0.4mm BGA
|
是(样品)
|
是(样品)
|
|||
6
|
激光
|
激光打孔尺寸
|
0.07-0.2mm
|
0.05-0.2mm
|
|
激光打孔尺寸
|
≤1:1
|
≤1:1
|
|||
7
|
阻焊层
|
颜色
|
绿色、黄色、黑色、蓝色、红色、白色、哑光绿
|
绿色、黄色、黑色、蓝色、红色、白色、哑光绿
|
|
SM ThK
|
单次印刷厚度
|
10-30um
|
10-30um
|
||
双倍印刷厚度
|
20-60um
|
20-60um
|
|||
线角
|
≥5um
|
≥5um
|
|||
Min SM dam
|
普通颜色3.0mil,其他颜色最小4mil
|
普通颜色3.0mil,其他颜色最小4mil
|
|||
8
|
树脂堵漏
|
孔的大小
|
0.15-0.6mm
|
0.1-0.6mm
|
|
PCB ThK
|
0.3-3.0mm
|
0.3-3.0mm
|
|||
树脂堵孔纵横比
|
12:1
|
12:1
|
|||
9
|
阻抗板
|
阻抗能力
|
阻抗能力<50Ω
|
±5Ω
|
±3.5Ω
|
单线阻抗≥50Ω
|
±10%
|
±7%
|
|||
差分线路阻抗
|
±10%
|
±7%
|
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