Rigid PCB Manufacturing
Process capability
|
No.
|
Project
|
Sample
|
Batch
|
|---|---|---|---|
|
1
|
Number of layers
|
2-32 floors
|
2-18 floors
|
|
2
|
Plate
|
Rogers, Arlon, Tacoic,Bergquist
|
Rogers, Arlon, Tacoic,Bergquist
|
|
3
|
Biggest size
|
635mm x 1100mm
|
635mm x 1100mm
|
|
4
|
Plate thickness to aperture ratio
|
13:01:00
|
10:01:00
|
|
5
|
Minimum line width
|
0.06mm
|
0.08mm
|
|
6
|
Minimum spacing
|
0.06mm
|
0.08mm
|
|
7
|
Drilling hole diameter (mechanical drill)
|
0.15mm--6.35mm
|
0.20mm--6.35mm
|
|
8
|
Hole diameter (mechanical drill)
|
0.10mm--6.35mm
|
0.15mm--6.30mm
|
|
9
|
Hole diameter tolerance (mechanical drill)
|
±0.05mm
|
±0.07mm
|
|
10
|
Hole position tolerance (mechanical drill)
|
0.075mm
|
0.1mm
|
|
11
|
Media thickness
|
0.10mm--3.0mm
|
0.10mm--3.0mm
|
|
12
|
Plate thickness range
|
0.2mm--8.0mm
|
0.2mm--6.0mm
|
|
13
|
Plate thickness tolerance (t≥0.8mm)
|
±13%
|
±13%
|
|
14
|
Plate thickness tolerance (t＜0.8mm)
|
±10%
|
±10%
|
|
15
|
Outer copper thickness
|
35um--455um
|
35um--350um
|
|
16
|
Inner layer copper thickness
|
18um--175um
|
18um--105um
|
|
17
|
Solder mask type
|
Photosensitive ink
|
Photosensitive ink
|
|
18
|
Minimum solder mask bridge width
|
0.10mm
|
0.10mm
|
|
19
|
Minimum Solder Mask Isolation Ring
|
0.05mm
|
0.10mm
|
|
20
|
Plug hole diameter
|
0.30mm—0.50mm
|
0.30mm—0.50mm
|
|
21
|
Impedance tolerance
|
±10%
|
±10%
|
|
22
|
Surface treatment type
|
With/lead-free spray tin, chemical nickel gold, immersion tin, immersion silver, nickel gold plating, OSP
|
Hot air leveling, electroless nickel gold, immersion tin, nickel gold plating, OSP
|
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