Thick-Copper – LUCKPCB

Thick-Copper PCB

“A multilayer PCB has more than two copper layers. Multilayer PCBs save space and increase circuit density. PCB layers are possible up to 64 at the multilayer PCB manufacturer LuckTech.”

Thick-Copper PCB

Technical Capabilities

No.	Project	Sample	Batch
1	Number of layers	2-32 floors	2-18 floors
2	Plate	Rogers, Arlon, Tacoic,Bergquist	Rogers, Arlon, Tacoic,Bergquist
3	Biggest size	635mm x 1100mm	635mm x 1100mm
4	Plate thickness to aperture ratio	13:01:00	10:01:00
5	Minimum line width	0.06mm	0.08mm
6	Minimum spacing	0.06mm	0.08mm
7	Drilling hole diameter (mechanical drill)	0.15mm--6.35mm	0.20mm--6.35mm
8	Hole diameter (mechanical drill)	0.10mm--6.35mm	0.15mm--6.30mm
9	Hole diameter tolerance (mechanical drill)	±0.05mm	±0.07mm
10	Hole position tolerance (mechanical drill)	0.075mm	0.1mm
11	Media thickness	0.10mm--3.0mm	0.10mm--3.0mm
12	Plate thickness range	0.2mm--8.0mm	0.2mm--6.0mm
13	Plate thickness tolerance (t≥0.8mm)	±13%	±13%
14	Plate thickness tolerance (t＜0.8mm)	±10%	±10%
15	Outer copper thickness	35um--455um	35um--350um
16	Inner layer copper thickness	18um--175um	18um--105um
17	Solder mask type	Photosensitive ink	Photosensitive ink
18	Minimum solder mask bridge width	0.10mm	0.10mm
19	Minimum Solder Mask Isolation Ring	0.05mm	0.10mm
20	Plug hole diameter	0.30mm—0.50mm	0.30mm—0.50mm
21	Impedance tolerance	±10%	±10%
22	Surface treatment type	With/lead-free spray tin, chemical nickel gold, immersion tin, immersion silver, nickel gold plating, OSP	Hot air leveling, electroless nickel gold, immersion tin, nickel gold plating, OSP